From 23 to 26 October 2022, Syntegon will present its versatile portfolio of processing and packaging solutions at Pack Expo in Chicago/USA. Visitors to booth S-3514 and the Emerging Brands Summit booth EB-15 in S-100 can expect insights into innovative robotic handling solutions, automation technologies as well as advanced and sustainable system concepts for primary and secondary packaging.

One of the highlights at the booth will be the official launch of the new Intelligent Direct Handling (IDH) pick-and-place system for cookies, crackers and biscuits. Additionally, the packaging experts will showcase their comprehensive system competence with displays of the RPP robotic pick-and-place platform in combination with a MEC endload cartoner as well as a SVE 2520 Doy Zip vertical bagger with an Elematic 3001 case packer.

“We not only unite our renowned brands like Kliklok, Doboy, Elematic, Makat, Woodman, Osgood and Sigpack under a common Syntegon umbrella, we also offer various technologies that cater to different needs and facilitate the shift towards future-proof and sustainable packaging processes for our customers,” says Brad Baker, Sales Director North America.