08/03/2018 | Trade Fair, Packaging

Anuga FoodTec and international packaging community intensify fight against food waste

Meanwhile, huge amounts of edible food are wasted, either in the supply chain up to the consumer or at home by that same consumer after purchase. International trade fair Anuga FoodTec (20 to 23 March 2018) and the packaging community have now joined forces to chart where existing packaging may help in limiting food waste and to define areas where future packaging innovations may be needed. Two key events will take place on 22 March 2018 in Cologne: the international conference “Fighting food waste together: how to open the potential of better packaging” at the Anuga FoodTec Forum Resource Efficiency and the NVC Zero Food Waste Dinner.

Visitors to the Anuga FoodTec may express their support for the fight against food waste by folding and subsequently using their own promotional fighting food waste lunch box during their stay in Cologne. Important functionalities of food packaging in the fight against food waste are displayed on the box. The fighting food waste lunch boxes are available for free at the stand of the NVC Packaging Centre, Boulevard B 33.

To register for the NVC Zero Food Waste Dinner, contact the NVC association office at To register for an Anuga FoodTec visit and the international conference, just go to